IC189-0162-019 Datasheet, PDF (1/7 Pages) List of Unclassifed Manufacturers – SOP (Small Outline Packages, Gullwing Leads)

SMT Devices
Series Overview
*SOP (Small Outline Packages, Gullwing Leads)
Series IC51 (Clamshell)
SOP, TSOP Type I & II
*SOP variations e.g. TSSOP...
0.4 to 1.27mm Pitch
Specifications
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C (for type PSF)
–55°C to +170°C (for type PES & PEI)
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part Number (Details)
IC51 - 028 2 - 334-1 - MF
Series No.
No. of Contact Pins
No. of Sides with Contacts
Design Number
MF= Flanged
Unmarked = Not Flanged
Series IC189 (Open Top)
SOP, TSOP Type I & II
0.4 to 1.27mm Pitch
Specifications
Insulation Resistance:
1,000MΩ min. at 100V DC, pitch 0.4, 0.5
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5
500V AC for 1 minute, pitch 0.65
700V AC for 1 minute, pitch 0.8, 1.27
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions
Contact Force:
20g to 80g per pin
Materials and Finish
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part Number (Details)
IC189 - 016 2 019
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protection Key
* -*
**Protection Key: Prevents IC from releasing during transportation
Series IC235 (Open Top)
SOP, TSOP Type II
Specifications
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions min.
Contact Force:
20g to 80g per pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
0.8 and 1.27mm Pitch
Part Number (Details)
IC235 - 020 2 - 201 - *
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
40 Test Solutions
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER