AD021-00E Datasheet, PDF (2/12 Pages) List of Unclassifed Manufacturers – Package Drawings and Specifications

Appendix
Package Drawing – TDFN6 2.5 mm x 2.5 mm
0.80 MAX
6
4
2.00 ± 0.05
4
6
1
3
PIN 1 INDEX AREA
2.50 ± 0.10
0.0-0.05
C0.10
PIN 1 ID
3
0.30 ± 0.05(6x)
1
0.65 TYP. (4x)
0.30 ± 0.05(6x)
1.30 REF (2X)
0.20 REF.
Note: Dimensions in mm. TDFN6 package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – TDFN SO8
PIN 1 INDEX AREA
0.75±0.05
4
1
1
4
Pin 1 ID
3.90 ± 0.15
5
8
4.900 ± 0.20
5
0.0-0.05 0.40 ± 0.05 (8x)
3.81REF (2x)
0.65 ± 0.10 (8x)
5
1.27 Typ. (6x)
0.75±0.05 MAX
Note: Dimensions in mm. TDFN SO8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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