AD021-00E Datasheet, PDF (1/12 Pages) List of Unclassifed Manufacturers – Package Drawings and Specifications

Appendix
Appendix
Package Drawings and Specifications
Package Drawing – SOIC8
.193 (4.90)
.236 (5.99)
NVE
XXXXX
-XX
.154 (3.91)
.016 (.40) NOM.
.020 (.508)
.154 (3.91)
.015 (.381)
x 45°
.188 (4.77)
Dimensions: inch (mm)
.017 TYP.
.054 (1.37)
.061 (1.55)
.050 (1.27) x 6
BASIC
.004 (.10) MIN.
.010 (.26) MAX.
Note: SOIC8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – MSOP8
.118
(3.00)
.193 (4.90)
NVE
XXX
.118 (3.00)
.012 TYP.
Dimensions: inches (mm)
.034 (.86)
.005 (.13) NOM.
.118 (3.00)
.021 (.533)
.154 (3.91)
.040 (1.02)
.0256 (.65) x 6
BASIC
.004 (.10) MIN.
.012 (.31) MAX.
Note: MSOP8 Package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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