57C128FB Datasheet, PDF (2/13 Pages) List of Unclassifed Manufacturers – MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16K X 8-BIT ULTRA VIOLET

1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87661
01
X
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number 1/
27C128
27C128
27C128
27C128
27C128
27C128
27C128
27C128
Circuit function
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
16K x 8-bit UVEPROM
Access time
90 ns
120 ns
150 ns
170 ns
200 ns
250 ns
300 ns
70 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
Terminals
28
32
Package style 1/
dual-in-line package
rectangular leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V_CC) 2/ .....................................................
Supply voltage range (V_PP) 2/ .....................................................
All input voltage range except A₉ 2/ ..........................................
Input voltage range (A₉) 2/ ..........................................................
Output voltage range 2/ ..............................................................
Storage temperature range ........................................................
Power dissipation ........................................................................
Lead temperature (soldering, 10 seconds) ..................................
Thermal resistance, junction-to-case (θ_JC) ...................................
Junction temperature (T_J) ..........................................................
Data retention ............................................................................
-0.6 V dc to 6.25 V dc
-0.6 V dc to 14.0 V dc
-0.6 V dc to 6.25 V dc
-0.6 V dc to 13.5 V dc
-0.6 V dc to V_CC + 1.0 V dc
-65C to +150C
300 mW
+300C
See MIL-STD-1835
+150C 3/
10 years minimum
1.4 Recommended operating conditions.
Supply voltage range (V_CC) 4/ ....................................................
Supply voltage range (V_PP) 5/ .....................................................
High level input voltage range (V_IH)..............................................
High level input voltage range (V_IH)..............................................
Low level input voltage range (V_IL) .............................................
Low level input voltage range (V_IL) .............................................
Case operating temperature range (T_C) ......................................
4.5 V dc to 5.5 V dc
4.5 V dc to 5.5 V dc
2.0 V dc to 6.5 V dc (TTL)
V_CC -0.2 V dc to V_CC +0.2 V dc (CMOS)
-0.1 V dc to 0.8 V dc (TTL)
GND -0.2 to GND +0.2 V dc (CMOS)
-55C to +125C
1/ Lid shall be transparent to permit ultraviolet light erasure.
2/ Under absolute maximum ratings, voltages are with respect to GND.
3/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life.
4/ V_CC must be applied before or at the same time as V_PP and removed after or at the same time as V_PP. The device must
not be inserted into or removed from the board when V_PP or V_CC is applied.
5/ V_PP can be connected to V_CC directly (except in the program mode). V_CC supply current in this case would be I_CC + I_PP.
During programming, V_PP must be maintained at 12.5 V (±0.5 V).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-87661
SHEET
2