M02009 Datasheet, PDF (17/19 Pages) M/A-COM Technology Solutions, Inc. – Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps

Product Specification
2.5
Bare Die Layout and X Y Coordinates
Table 2-5. Bare Die Layout Example
Pad
GND
GNDDOUT
DOUT
MON
VCC
PINK
PINA
VCC
AGC
DOUT
GNDDOUT
GND
X
Y
-307 300
-307 150
-307
0
-307 -150
-307 -300
-99.25 -397
124.8 -397
307 -300
307 -150
307
0
307
150
307
300
Notes:
Process technology: CMOS, Silicon Nitride passivation
Die thickness: 300 µm
Pad metallization: Aluminum
Die size: 890 µm x 1020 µm
Pad opening: 86 µmsq
Octagonal pad: 70 µm across flat
Pad Centers in µm referenced to center of device.
02009-DSH-001-D
Mindspeed Technologies™
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