M02009 Datasheet, PDF (12/19 Pages) M/A-COM Technology Solutions, Inc. – Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps

M02009 Data Sheet
1.3.5
Assembly
The M02009 is designed to work with a wirebond inductance of 1 nh +/- 0.25 nh. Many existing TO-Can configura-
tions will not allow wirebond lengths that short, since the PIN diode submount and the TIA die are more than 1 mm
away in the vertical direction, due to the need to have the PIN diode in the correct focal plane. This can be remedi-
ated by raising up the TIA die with a conductive metal shim. This will effectively reduce the bond wire length. Refer
to Figure 5 on the following page for details. Mindspeed recommends ball bonding with a 1 mil
(25µm) gold wire.
In addition, please refer to the Mindspeed Product Bulletin (document number 0201X-PBD-001). Care must be
taken when selecting chip capacitors, since they must have good low ESR characteristics up to 1 Ghz. It is also
important that the termination materials of the capacitor be compatible with the attach method used.
Tin/Lead (Pb/Sn) or Tin (Sn) solder finish capacitors are incompatible with silver-filled epoxies. Palladium/Silver
(Pd/Ag) terminations are compatible with silver filled epoxies. Solder can be used only if the substrate thick-film
inks are compatible with Tin-bearing solders.
7
Mindspeed Technologies™
02009-DSH-001-D
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