TS30012 Datasheet, PDF (13/18 Pages) List of Unclassifed Manufacturers – High Efficiency 1A/2A/3A Current-Mode Synchronous Buck DC/DC Converter, 1MHz

TS30011/12/13
Version 1.6
The exposed thermal pad must be soldered to the PCB for mechanical reliability and to achieve good power dissipation. Vias
must be placed under the pad to transfer the heat to the ground plane.
C_OUT
C_OUT
VOUT
L_OUT
Switching
node
Vias to
ground
plane
D_CATCH
C_BYP
C_BYPASS
VSW
VCC
VCC
GND
VSW
VCC
BST
EN
R_PLP
R_BOT
R_TOP
PGND
VCC
Analog
ground
(GND)
Vias to
ground
plane
Figure 23: TS30011/12/13 PCB Layout, Top View
EXTERNAL COMPONENT BILL OF MATERIALS
Designator Function
Description
Suggested
Manufacturer
Manufacturer Code
Qty
CBYPASS
Input Supply Bypass
Capacitor
10uF 10%
35V
TDK
CGA5L3X5R1V106K160AB
1
COUT
Output Filter Capacitor
22uF 10%
10V
TDK
C2012X5R1A226K125AB
2
LOUT
Output Filter Inductor (1A)
4.7uH 2A
TDK
Wurth
SLF7045T-4R7M2R0-PF
7447745047
1
LOUT
Output Filter Inductor (2A)
4.7uH 3A
TDK
Wurth
VLC5045T-4R7M
744774047
1
LOUT
Output Filter Inductor (3A) 4.7uH 4.37A
TDK
Wurth
VLP6045LT-4R7M
744777004
1
CBST
Boost Capacitor
22nF 10V
TDK
C1005X7R1C223K
1
Specifications subject to change
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