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SGU02G64A1BD1SA-BBR Datasheet, PDF (1/16 Pages) List of Unclassifed Manufacturers – 2048MB DDR3 . SDRAM UDIMM | |||
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Data Sheet
Rev.1.0 12.04.2013
2048MB DDR3 â SDRAM UDIMM
240 Pin UDIMM
SGU02G64A1BD1SA-xxR
2GByte in FBGA Technology
RoHS compliant
Options:
ï§ Data Rate / Latency
DDR3 1066 MT/s CL7
DDR3 1333 MT/s CL9
DDR3 1600 MT/s CL11
Marking
-BB
-CC
-DC
ï§ Module Density
2048MB with 8 dies and 1 rank
ï§ Standard Grade
Grade W
(TA)
0°C to 70°C
(TC)
0°C to 85°C
(TA) -40°C to 85°C
(TC) -40°C to 95°C
Environmental Requirements:
ï§ Operating temperature (ambient)
Standard Grade
0°C to 70°C
Grade W
-40°C to 85°C
ï§ Operating Humidity
10% to 90% relative humidity, noncondensing
ï§ Operating Pressure
105 to 69 kPa (up to 10000 ft.)
ï§ Storage Temperature
-55°C to 100°C
ï§ Storage Humidity
5% to 95% relative humidity, noncondensing
ï§ Storage Pressure
1682 PSI (up to 5000 ft.) at 50°C
Features:
ï§ 240-pin 64-bit DDR3 unbuffered Dual-In-Line Double Data
Rate Synchronous DRAM module
ï§ Module organization: single rank 256M x 64
ï§ VDD = 1.5V ±0.075V, VDDQ 1.5V ±0.075V
ï§ 1.5V I/O ( SSTL_15 compatible)
ï§ Fly-by-bus with termination for C/A & CLK bus
ï§ On-board I2C temperature sensor with integrated serial
presence-detect (SPD) EEPROM
ï§ Gold-contact pads
ï§ This module is fully pin and functional compatible to the
JEDEC PC3-12800 spec. and JEDEC- Standard MO-268.
(see www.jedec.org)
ï§ The pcb and all components are manufactured according
to the RoHS compliance specification [EU Directive
2002/95/EC Restriction of Hazardous Substances (RoHS)]
ï§ DDR3 - SDRAM component Samsung
K4B2G0846D-HCH9 DIE-Rev.D (up to 1333MT/s)
K4B2G0846D-XXXX DIE-Rev.D (up to 1600MT/s)
ï§ 256Mx8 DDR3 SDRAM in PG-TFBGA-78 package
ï§ 8-bit prefetch architecture
ï§ Programmable CAS Latency, CAS Write Latency, Additive
Latency, Burst Length and Burst Type.
ï§ On-Die-Termination (ODT) and Dynamic ODT for improved
signal integrity.
ï§ Refresh. Self Refresh and Power Down Modes.
ï§ ZQ Calibration for output driver and ODT.
ï§ System Level Timing Calibration Support via Write Leveling
and Multi Purpose Register (MPR) Read Pattern.
Figure: mechanical dimensions1
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Fon: +41 (0) 71 913 03 03
Fax: +41 (0) 71 913 03 15
1if no tolerances specified ± 0.15mm
www.swissbit.com
eMail: info@swissbit.com
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