CFK2162-P3 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – 1.8 to 2.0 GHz +34 dBm Power GaAs FET

CFK2162-P3
Product Specifications - July 1997
(4 of 4)
Thermal Considerations
The data shown was taken on a 31 mil thick FR-4 board with 1 ounce copper on both sides. The board was mounted to a base-
plate with 3 screws as shown. The screws bring the top side copper temperature to the same value as the baseplate. The thermal
resistance to the indicated reference lead, Θ_JL, is 10°C/W. The thermal resistance to the reference screw is 12°C/W.
1. Use 1 or 2 ounce copper if possible.
2. Solder all eight leads of the CFK2162-P3 package to the appropriate electrical connection.
3. Solder the copper pad on the backside of the CFK2162-P3 package to the ground plane.
4. Use a large ground pad area with many plated through-holes as shown.
5. If possible, use at least one screw no more than 0.2 inches from the CFK2162-P3 package to provide a low thermal resistance
path to the baseplate of the package.
Ordering Information
The CFK2162-P3 power stage is available in a SO-8 surface mount package. Devices are available in tape and reel. Ordering part
numbers are listed.
Part Number for Ordering
CFK2162-P3
CFK2162-P3-000T
Function
1.8 - 2.0 GHz Power Stage
1.8 - 2.0 GHz Power Stage
Package
SO-8 surface mount power package
SO-8 surface mount power package in tape and reel
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