RL201 Datasheet, PDF (3/5 Pages) Wing Shing Computer Components – SILICON RECTIFIER(VOLTAGE RANGE - 50 to 1000 Volts CURRENT - 2.0 Amperes)

Recommended Attachment Methods (Continued)
Recommended Attachment to Soft or Hard Substrate Using Solder:
Solder Thickness:
.004” - .006”
Solder Diameter:
.010 - .015”)
Recommended Micro‐Strip Layout:
Gap:
.008” - .010”
Distance from Trace Edge:
.001” - .002”
Ideal Micro Strip Width:
.012” - .015”
Attachment Method:
1. Place a single drop of solder paste onto each micro‐strip line as illustrated. The
edge of the solder paste shall be at least 0.001"‐0.002" back from the edge of the
trace to prevent filling the gap with solder.
2. Centering the termination gap of the capacitor within the gap in the micro‐strip,
press with careful, even pressure onto the micro‐strip ensuring the terminations
make good contact with the drops of solder paste.
3. Reflow according to the solder manufacturer's preferred profile, ensuring the
reflow temperature does not exceed 250°C.
4. After the reflow step is completed, inspect the joint for voids or excess flux and
non‐reflowed solder balls that can degrade performance or cause shorts across the
gaps. Proper cleaning after the reflow process is crucial to avoiding performance
degradation and discovering poor solder joints.
Isopropanol and Methanol are both safe to use with soldered Milli‐Caps ®