RL201 Datasheet, PDF (2/5 Pages) Wing Shing Computer Components – SILICON RECTIFIER(VOLTAGE RANGE - 50 to 1000 Volts CURRENT - 2.0 Amperes)

Termination Finish and Recommended Attachment Methods
Code
S
Termination
Description
Ag Termination, minimum 50µ" Ni barrier layer, 7.5 ± 5µ" Au flash.
Recommended Attachment Materials
Conductive Epoxy (EPO TEK ® H20E, Ablebond ® 84‐1 LMI, etc.)
Solder (SN62, SN63, etc.)
Recommended Attachment to Soft or Hard Substrate Using Conductive Epoxy:
Epoxy Thickness:
.003” - .005”
Recommended Micro‐Strip Layout:
Gap:
.008” - .010”
Epoxy Diameter:
.005 - .008”
Distance from Trace Edge:
.003” - .004”
Ideal Micro Strip Width:
.012” - .015”
Attachment Method:
1. Place a single drop of conductive epoxy onto each micro‐strip line as illustrated.
The edge of the epoxy shall be at least 0.003"‐0.004" back from the edge of the
trace to prevent filling the gap with epoxy.
2. Centering the termination gap of the capacitor within the gap in the micro‐strip,
press with careful, even pressure onto the micro‐strip ensuring the terminations
make good contact with the epoxy drops.
3. Cure according to the epoxy manufacturer's preferred schedule
Typically 125°C to 150°C Max.
4. After curing, inspect the joing for epoxy shorts across the termination and
microstrip gaps that would cause a short across the gap.
Isopropanol and Methanol are both safe to use to pre‐clean Milli‐Caps ®
They are not to be used after mounting with conductive epoxy as they act as a solvent.