BC01B Datasheet, PDF (12/15 Pages) List of Unclassifed Manufacturers – Single Chip Bluetooth Device

Product Data Sheet
Assembly Guidelines
Assembly Guidelines
Figures 5 and 6 show the re-flow solder profile that was used to qualify the BlueCore01b packages.
This temperature profile was repeated three times during the qualification of the BlueCore01b packages with a
maximum temperature of 235°C.
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Figure 5: Re-flow solder profile 1
Whereas the above profile was used to confirm the reliablility of the BlueCore01b packages, the following
(figure 6) is the recommended solder profile to use when assembling BlueCore01b onto a circuit board.
Recommended Solder Profile
Initial Ramp: 60°C to 120°C/minute to 140°C to 150°C equilibrium 90°C to 120°C/minute ramp to 210°C to 220°C
maximum temperature. Time over liquidus should be 45 to 90 seconds. Rapid quenching provides superior
cosmetic appearance and bond strength.
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Time in minutes
Figure 6: Re-flow solder profile 2
Production Information
bco1b-ds-003d