EESX1109 Datasheet, PDF (9/9 Pages) List of Unclassifed Manufacturers – Ultra-Compact Photomicrosensors with Surface-Mount Design

EE-SX1107/1108/1109/1131
Precautions
s SOLDERING INFORMATION
Reflow soldering
• Reflow soldering must be done within 48 hours after opening
the aluminum envelope. The component must be stored
under 30°C at 80% RH.
• The following soldering paste is recommended:
Melting temperature: 178~192°C
Composition: Sn 63%, Pb 37%
• Recommended thickness of metal mask is between 0.2 mm
and 0.25 mm for screen printing.
• The following chart illustrates the maximum temperature
limits for soldering:
250
10 sec. max.
200
150
4°C/sec. max.
100
230°C max.
4°C/sec. max.
140~160°C
40 sec. max.
60~120 sec.
Time
Manual soldering
• "Sn 60" (60% tin and 40% lead) or solder with silver content
is recommended.
• Use a soldering iron of less than 25W. The temperature of
the iron tip must be kept above 300°C (572°F).
• Solder each land for a maximum of 3 seconds.
EE-SX1107/1108/1109/1131
OMRON ELECTRONICS LLC
One East Commerce Drive
Schaumburg, IL 60173
1-800-55-OMRON
Cat. No. E02DAD2
3/01
OMRON CANADA, INC.
885 Milner Avenue
Scarborough, Ontario M1B 5V8
416-286-6465
Specifications subject to change without notice.
Printed in the U.S.A.
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