MV04E050T101 Datasheet, PDF (8/9 Pages) List of Unclassifed Manufacturers – Multilayer Chip Varistor for Surge

Multilayer Chip Varistor for Surge and
ESD Protection – E Type Series
Document No TMVE-XXOS001C
Issued date
2012/02/13
Page
8/9
8.7.2 Recommended Soldering Condition 2（Without preheating）
(1) Solder iron tip shall not directly touch to ceramic dielectrics.
(2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to
the external electrode of Varistors.
8.8 Post Soldering Cleaning
8.8.1 Residues of corrosive soldering fluxes on the PC board after cleaning may
greatly have influences on the electrical characteristic and the reliability (such as
humidity resistance) of the Varistors which have been mounted on the board. It
shall be confirmed that the characteristic and the reliability of the devices are not
affected by the applied cleaning conditions
8.8.2 When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards.
Following conditions are recommended for preventing failures or damages of the
devices due to the large vibration energy and the resonance caused by the
ultrasonic waves.
(1) Frequency 29MHz max
(2) Radiated Power 20w/lithr max
(3) Period 5minuets max
9. Storage condition of products
9.1 Storage Conditions:
(1) Storage Temperature: -10℃~+40℃
(2) Relative humidity: ≦75%RH
(3) Varistor must be kept away from sunlight and stored in a non-corrosive
atmosphere.
9.2 Period of Storage: 1 year
10. ECN
Engineering Change Notice: The customer will be informed with ECN if there is
significant modification on the characteristics and materials described in Approval
Sheet.
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