TC1301 Datasheet, PDF (6/6 Pages) List of Unclassifed Manufacturers – Low Noise and Medium Power GaAs FETs

TC1301
LARGE SIGNAL MODEL, V_DS = 6 V, I_DS =80 mA
SCHEMATIC
Lg Rg
Cgs
Ris
Cgd Rid
Id
Cds
Rs
Ls
Rd Ld
Rdb
Cbs
REV.2_04/12/2004
TOM2 MODEL PARAMETERS
Parameters
Parameters
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
-0.43283 V
9.54
0.49
0.0416
0.3091
0.84
0.1
0.01
VMAX
CGD
CGS
CDS
RIS
RID
VBR
RDB
TAU
RG
RD
RS
IS
N
VBI
VDELTA
5.558 ps
2.0833 Ohm
1.358 Ohm
1.662 Ohm
1E-11 mA
1
1V
0.2 V
CBS
TNOM
LS
LG
LD
AFAC
NFING
0.5 V
0.0554 pF
6.018 pF
0.1599 pF
5.755 Ohm
0.001 Ohm
9V
94.333 Ohm
0.0463 pF
25 °C
0.01893 nH
0.0576 nH
0.038 nH
1
1
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool:
Tweezers; Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at
all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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