BBA-322-A Datasheet, PDF (6/8 Pages) List of Unclassifed Manufacturers – GENERAL-PURPOSE BROADBAND RF AMPLIFIER DATA GUIDE

TYPICAL APPLICATION:
The schematic below pictures a typical configuration for amplifying the output of
a low-cost narrowband transmitter. This configuration would result in a 6-7X
increase in system range. Note that such output levels may render the transmitter
illegal for operation in certain countries.
DATA IN
LINX LC SERIES TX
1
GND
GND
8
2
DATA IN
VCC
7
3
GND
GND
6
4
IADJ/GND RF OUT
5
VCC
ANT1
ANTENNA
LINX BBA-519
1
GND
RF OUT
8
2
VCC
GND
7
3
GND
GND
6
4
RF IN
GND
5
GND
GND
GND
GND
Typical Configuration
PRODUCTION GUIDELINES
The BBA modules are packaged in a hybrid SMD package which has been
designed to support hand- or automated-assembly techniques. Since BBA
devices contain discrete components internally, the assembly procedures are
critical to insuring the reliable function of the BBA product. The following
procedures should be reviewed with and practiced by all assembly personnel.
HAND ASSEMBLY
The BBA’s primary mounting surface is
eight pads located on the bottom of the
module. Since these pads are inaccessible
Soldering Iron
during mounting, castellations that run up ^Tip
the side of the module have been provided
to facilitate solder wicking to the module's
underside. If the recommended pad
placement has been followed, the pad on _Solder
the board will extend slightly past the edge
of the module. Touch both the PCB pad and _{PCB Pads}
Castellations
the module castellation with a fine
soldering tip. Tack one module corner first, BBA Soldering Technique
then work around the remaining
attachment points, using care not to exceed the solder times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Sec.
Hand-Solder Temp. RX +225°C for 10 Sec.
Recommended Solder Melting Point +180°C
Reflow Oven: +220° Max. (See adjoining diagram)
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