ARC241 Datasheet, PDF (5/6 Pages) List of Unclassifed Manufacturers – Array chip resistors size 4 X 0603

IEC
60 115-8
CLAUSE
IEC
60 068-2
TEST
METHOD
TEST
PROCEDURE
4.7
voltage proof on maximum voltage (RMS) during 1 minute,
insulation
metal block method
4.13
short time overload room temperature; P = 6.25 × P_n;
5 s (V ≤ 2 × V_max)
4.33
bending
resistors mounted on a 90 mm glass epoxy
resin PCB (FR4), bending: 5 mm
4.19
14 (Na) rapid change of 30 minutes at LCT and
temperature
30 minutes at UCT; 5 cycles
4.24.2
4.25.1
4.23.2
4.8.4.2
3 (Ca)
27 (Ba)
damp heat
(steady state)
endurance
endurance at upper
category
temperature
temperature
coefficient
56 days; 40 ±2 °C; 93 +2/−3% RH;
loaded with 0.01 P_n
1000 +48/−0 hours; 70 ±2 °C; loaded with
P_n or V_max; 1.5 hours on and 0.5 hours off
1000 +48/−0 hours; no load
at 20/LCT/20 °C and 20/UCT/20 °C
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
4.17
20 (Ta)
4.6.1.1
solderability
(after ageing)
insulation
resistance
8 hours steam or 16 hours 155 °C;
unmounted chips completely immersed for
2 ±0.5 s in a solder bath at 235 ±2 °C
voltage (DC) after 1 minute,
metal block method: 10 V
4.12
noise
IEC publication 60195 (measured with
Quantech-equipment):
R ≤ 100 Ω
100 Ω < R ≤ 1 kΩ
1 kΩ < R ≤ 10 kΩ
10 kΩ < R ≤ 100 kΩ
100 kΩ < R ≤ 1 MΩ
REQUIREMENTS
ARC241 ARV241
ARC242
ARV242
no breakdown or flashover
∆R/R max.: ±(1% +0.05 Ω)
no visible damage
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(0.5% +0.05 Ω)
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
∆R/R max.:
±(3% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
≤±200 × 10^−6/K
≤±100 × 10^−6/K ≤±200 × 10^−6/K
good tinning (≥95% covered);
no damage
R_ins min.: 10³ MΩ
max. 0.316 µV/V (−10 dB)
max. 1 µV/V (0 dB)
max. 3 µV/V (9.54 dB)
max. 6 µV/V (15.56 dB)
max. 10 µV/V (20 dB)