ARC241 Datasheet, PDF (4/6 Pages) List of Unclassifed Manufacturers – Array chip resistors size 4 X 0603

TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the schedule of
“IEC publication 60 115-8”, category LCT/UCT/56 (rated temperature
range: Lower Category Temperature, Upper Category Temperature;
damp heat, long term, 56 days). The testing also covers the requirements
specified by EIA and EIAJ.
The tests are carried out in accordance with IEC publication 60 068,
“Recommended basic climatic and mechanical robustness testing
procedure for electronic components” and under standard atmospheric
conditions according to “IEC 60068-1”, subclause 5.3.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with reference to the
relevant clauses of “IEC publications 60 115-8 and 60068”; a short
description of the test procedure is also given.
In some instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 4 Test procedures and requirements
IEC
60 115-8
CLAUSE
IEC
60 068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
ARC241 ARV241
ARC242
ARV242
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1
visual examination
4.4.2
4.5
4.18
20 (Tb)
dimensions
(outline; see Fig.3)
resistance
resistance to
soldering heat
gauge (mm)
applied voltage (+0/−10%):
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
R ≥ 1 MΩ: 50 V
unmounted chips; 10 ±1 s; 260 ±5 °C
4.29
45 (Xa) component solvent isopropyl alcohol or H₂O followed by
resistance
brushing in accordance with “MIL 202 F”
4.17
20 (Ta) solderability
unmounted chips completely immersed for
2 ±0.5 s in a solder bath at 235 ±2 °C
no holes; clean surface;
no visible damage
see Table 3
−
R − R_nom:
max. ±5%
R − R_nom:
max. ±1%
R − R_nom:
max. ±5%
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
no visible damage
∆R/R max.:
±(1% +0.05 Ω)
good tinning (≥95% covered);
no visible damage