TC1102 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – Super Low Noise GaAs FETs

TC1102
SMALL SIGNAL MODEL, V_DS = 2 V, I_DS = 10 mA
SCHEMATIC
Lg
Rg
Cgd
Cgs
Gm
Cds
Ri
T
Rd Ld
Rds
Rs
Ls
PARAMETERS
Parameters
Parameters
Lg
0.0384 nH ^Rs
1.72 Ohm
Rg
0.97 Ohm ^Ls
0.001 nH
Cgs
0.222 pF ^Cds
0.061 pF
Ri
1.78 Ohm ^Rds
328 Ohm
Cgd
0.0273 pF ^Rd
1.698 Ohm
Gm
53.3 mS ^Ld
0.0286 nH
T
1.49 psec
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool:
Tweezers; Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond
Force: 20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at
all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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