CCSTA14N40 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – N-Type, ThinPak

Application Notes
CCSTA14N40
N-Type, ThinPak^TM
Preliminary Data Sheet
1. The CCSTA14N40 uses an
undersized ceramic "lid" which
exposes the sensitive junction
termination edge (JTE) of the device.
The user is required to clean and
encapsulate the device
(recomend HYSOL FP4651) prior
to applying high voltage. This
prevents debris and contaminants
from compromising the JTE.
2. Use of a seperate gate return path
instead of the cathode power contact
is recomended to minimize the effects of
rapidly changing Anode-Cathode currents.
Figure 5. A suggested gate drive circuit.
3. For applications that require high voltage blocking for an extended period of time at high temperature
(>85^oC), it is recomended that the device V_DR be derated to 2kV.
4. Shorting resistor R_GK is application specific. It can control the gate drive requirements and some device
properties. However, R_GK = 10 Ohms satisfies most application requirements.
Package Dimensions
(All units in Inches)
Packaging and Handling
1. All metal surfaces are tinned using 63pb/37sn
solder.
2. Installation reflow temperature should not exceed
260^oC or internal package degradation may result.
3. Package may be cooled from either top or bottom.
4. Proper handling procedures must be observed to prevent electrostatic
discharge which may result in permanent damage to the gate of the
device.