PARANI-BCD210 Datasheet, PDF (3/25 Pages) List of Unclassifed Manufacturers – Bluetooth-serial Module

PARANI-BCD210
목차
1. 개요 ............................................................................................................................................................... 4
1.1 특징 ..................................................................................................................................................... 4
1.2 적용분야 .............................................................................................................................................. 4
1.3 블럭 다이어그램.................................................................................................................................. 5
1.4 핀 배치도............................................................................................................................................. 5
1.5 핀 설명 ................................................................................................................................................ 6
1.6 PCB 치수 ............................................................................................................................................. 8
1.7 권장 랜드 패턴.................................................................................................................................. 10
1.8 권장 보드 배치.................................................................................................................................. 10
2. 전기적 특성 .................................................................................................................................................11
2.1 절대적 한계치 ....................................................................................................................................11
2.2 권장 동작 범위...................................................................................................................................11
2.3 전력 소모............................................................................................................................................11
3. RF 특성 ....................................................................................................................................................... 12
3.1 Basic Data Rate.................................................................................................................................. 12
3.1.1 송신부 성능............................................................................................................................. 12
3.1.2 송신부...................................................................................................................................... 12
3.1.3 수신부 성능............................................................................................................................. 12
3.2 Enhanced Data Rate .......................................................................................................................... 13
3.2.1 송신부 성능............................................................................................................................. 13
3.2.2 수신부 성능............................................................................................................................. 14
4. 장비 입출력 설명 ....................................................................................................................................... 15
4.1 UART 인터페이스 .............................................................................................................................. 15
4.2 USB 인터페이스 ................................................................................................................................ 15
4.3 I2C 인터페이스 .................................................................................................................................. 16
4.4 PCM CODEC 인터페이스.................................................................................................................. 16
4.5 I/O 병렬 포트 (I/O Parallel Ports) ..................................................................................................... 17
4.6 리셋 인터페이스 (Reset Interface) ................................................................................................... 17
5. 응용 회로도 (Application Schematic) ........................................................................................................ 18
6. 소프트웨어 스택 ......................................................................................................................................... 21
7. 납땜 프로파일 (Solder Profiles) ................................................................................................................. 22
8. 패키징 정보 ................................................................................................................................................ 23
9. 인증정보...................................................................................................................................................... 24
9.1 FCC .................................................................................................................................................... 24
9.2 CE....................................................................................................................................................... 24
9.3 IC ........................................................................................................................................................ 25
9.4 KC....................................................................................................................................................... 25
9.5 TELEC ................................................................................................................................................ 25
9.6 SIG ..................................................................................................................................................... 25
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