OP16GN8 Datasheet, PDF (3/14 Pages) List of Unclassifed Manufacturers – Add device type 04 for device class V and radiation hardened requirements

1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
G
MACY1-X8
8
P
GDIP1-T8 or CDIP2-T8
8
Can
Dual-in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V_S):
Devices 01, 02, and 04:
Positive supply voltage (V+)...................................................................... +22 V dc
Negative supply voltage (V-) ..................................................................... -22 V dc
Device 03:
Positive supply voltage (V+)...................................................................... +18 V dc
Negative supply voltage (V-) ..................................................................... -18 V dc
Differential input voltage:
Devices 01, 02, and 04 ................................................................................. ±40 V dc
Device 03 ..................................................................................................... ±30 V dc
Input voltage:
Devices 01, 02, and 04 ................................................................................. ±20 V dc
Device 03 ..................................................................................................... ±16 V dc
Maximum power dissipation (P_D)..................................................................... 500 mW 2/
Output short circuit duration ............................................................................. Indefinite
Storage temperature range .............................................................................. -65°C to +150°C
Lead temperature (soldering, 60 seconds) ...................................................... +300°C
Junction temperature (T_J) ................................................................................ +150°C
Thermal resistance, junction-to-case (θ_JC) ...................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ_JA):
Case G ......................................................................................................... 150°C/W
Case P.......................................................................................................... 119°C/W
1.4 Recommended operating conditions.
Supply voltage (V_S) ......................................................................................... ±15 V
Ambient operating temperature (T_A) ................................................................ -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............................ 100 krads 3/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Derate linearly 6.7 mW/°C above T_A = +75°C for P package; Derate linearly 7.1 mW/°C above T_A = +80°C for G package.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-89543
SHEET
3