MAX1037EKA Datasheet, PDF(3/8 Page) List of Unclassifed Manufacturers

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MAX1037EKA Datasheet, PDF (3/8 Pages) List of Unclassifed Manufacturers – PLASTIC ENCAPSULATED DEVICES

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II. Manufacturing Information

A. Description/Function:

B. Process:

C. Number of Device Transistors:

D. Fabrication Location:

E. Assembly Location:

F. Date of Initial Production:

2.7V to 5.5V, Low-Power, 12-Channel 2-Wire Serial 8-Bit ADC

S6 BiCMOS process

6283

California, USA

Malaysia

April, 2002

III. Packaging Information

A. Package Type:

8-Lead SOT

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Non-Conductive Epoxy

E. Bondwire:

Gold (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-2101-0053

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

B. Passivation:

C. Interconnect:

D. Backside Metallization:

E. Minimum Metal Width:

F. Minimum Metal Spacing:

G. Bondpad Dimensions:

H. Isolation Dielectric:

I. Die Separation Method:

66 x 45 mils

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

TiW/ AlCu/ TiWN

None

.6 microns (as drawn)

5 mil. Sq.

SiO2

Wafer Saw

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