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HCPLM700 Datasheet, PDF (3/8 Pages) List of Unclassifed Manufacturers – Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers
3
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature ................................................. -55°C to +125°C
Operating Temperature ............................................... -40°C to +85°C
Average Input Current - IF ........................................................ 20 mA
Peak Input Current - IF .............................................................. 40 mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF .............................................. 1.0 A
(≤1 µs pulse width, 300 pps)
Reverse Input Voltage - VR .............................................................. 5 V
Input Power Dissipation ........................................................... 35 mW
Output Current - IO (Pin 5) ........................................................ 60 mA
Supply and Output Voltage - VCC (Pin 6-4),VO (Pin 5-4)
HCPL-M700 ................................................................... -0.5 V to 7 V
HCPL-M701 ................................................................. -0.5 V to 18 V
Output Power Dissipation .........................................................1..0..0...m...W..
Infrared and Vapor Phase Reflow Temperature .................. see below
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Maximum Solder Reflow Thermal Profile.
(Note: Use of Non-Chlorine Activated Fluxes is Recommended.)
Insulation Related Specifications
Parameter
Symbol
Min. External Air Gap
(Clearance)
L(IO1)
Min. External Tracking Path
(Creepage)
L(IO2)
Min. Internal Plastic Gap
(Clearance)
Tracking Resistance
CTI
Isolation Group (per DIN VDE 0109)
Value
≥5
≥5
0.08
175
IIIa
Units
mm
mm
mm
V
Conditions
Measured from input terminals
to output terminals
Measured from input terminals
to output terminals
Through insulation distance
conductor to conductor
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0109