PD63000 Datasheet, PDF (2/4 Pages) List of Unclassifed Manufacturers – PoE Microcontroller Unit

PD63000
8-bit PoE Microcontroller Unit
Package Information
The PD63000 is housed in a 64-pin LQFP plastic package, 10 x 10 x 1.4 mm, meeting JEDEC’s MS-026 package
outline and dimensions.
0.2 H A-B D 4 Pls
64
PIN 1
IDENTIFIER
1
7
0.2 C A-B D
D
49
48
0.05
(S)
A
VIEW Y
16
17
D1/2
D/2
D1
D
B
A2
E1 ^E
A1
E/2
E1/2
33
32
R
R1
L
(L1)
VIEW AA
0.25
GAGE
PLANE
Z
SECTION AB - AB
BASE
ROTATED° 90CW
8
METAL
b1
c
c
1
PLATING
b
Z2
A
H
(x4)
J
C
SEATING
PLANE
b (x64)
0.08 C A-B D
X=A,B or D
AB
X
AB
e/2
e (x60) VIEW Y
VIEW AA
0.08 C
J
Z3
(x4)
Notes:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME
Y14.5m-1994.
3. Datums A, B and D to be determined at datum
plane H.
4. Dimensions D and E to be determined at seating
plane C.
5. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall not cause the
lead width to exceed the maximum b dimension
by more than 0.08 mm. Dambar cannot be
located on the lower radius or the foot. Minimum
space between protrusion and adjacent lead or
protrusion 0.07mm.
6. Dimensions D1 and E1 do not include mold
protrusion. Allowable protrusion is 0.25mm per
side. D1 and E1 are maximum plastic body size
dimensions including mold mismatch.
7. Exact shape of each corner is optional.
8. These dimensions apply to the flat section of the
lead between 0.10mm and 0.25mm from the lead
tip.
G
www.powerdsine.com
06-0008-058(Rev. 1.4) / 10 March 2004
F
VIEW J-J
EXPOSED
PAD
2
Dim.
A
A1
A2
b
b1
c
c1
D
D1
e
E
E1
Min.
Max.
---
1.60
0.05
0.15
1.35
1.45
0.17
0.27
0.17
0.23
0.09
0.20
0.09
0.16
12.00 BSC
10.00 BSC
0.50 BSC
12.00 BSC
10.00 BSC
Dim.
L
L1
R1
R2
S
F
G
Z
Z1
Z2
Z3
Min.
Max.
0.45 0.75
1.00 REF.
0.08
---
0.08
---
0.20
---
6.00 7.00
6.00 7.00
0°
7°
0°
---
11 ° 13 °
11 °
13 °
© PowerDsine 2004
Information in this document subject
to change without prior notice.