SCA61T Datasheet, PDF (17/18 Pages) List of Unclassifed Manufacturers – INCLINOMETER SERIES

SCA61T Series
4.2 Reflow Soldering
The SCA61T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 17. Recommended SCA61T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature
Average ramp-up rate (T_L to T_P)
Preheat
- Temperature min (T_smin)
- Temperature max (T_smax)
- Time (min to max) (ts)
Tsmax to T, Ramp up rate
Time maintained above:
- Temperature (T_L)
- Time (t_L)
Peak temperature (T_P)
Time within 5°C of actual Peak Temperature (T_P)
Ramp-down rate
Time 25° to Peak temperature
Sn-Pb Eutectic
Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5°C
10-30 seconds
6°C/second max
6 minutes max
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
250 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
• Preheating time and temperatures according to solder paste manufacturer.
• It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
• Wave soldering is not recommended.
• Ultrasonic cleaning is not allowed. The sensing element may be damaged by ultrasonic
cleaning process.
VTI Technologies Oy
www.vti.fi
Subject to changes
Doc. nr. 8261900
17/18
Rev.A