OZ6933 Datasheet, PDF (15/15 Pages) List of Unclassifed Manufacturers – ACPI CardBus Controller

208 PIN – BGA
OZ6933
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. "e" REPRESENTS THE SOLDER BALL GRID PITCH.
3. "N" REPRESENTS THE MAXIMUM NUMBER OF SOLDER BALLS FOR MATRIX SIZE
M1 AND M2.
4. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER AFTER
REFLOW AND PARALLEL TO PRIMARY DATUM Z, THE ORIGINAL SOLDER BALL
DIAMETER IS 0.45 mm.
5. PRIMARY DATUM Z AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
6. A1 CORNER MUST BE IDENTIFIED BY INK MARK, METALLIZED MARKINGS,
IDENTATION OR OTHER FEATURE OF PACKAGE BODY, LID OR INTEGRAL
HEATSLUG, ON THE TOP SURFACE OF THE PACKAGE.
7. SOLDER BALL DEPOPULATION IS ALLOWED. DEPOPULATION IS THE OMISSION OF
BALLS FROM A FULL MATRIX (M1 OR M2).
8. BALL PAD A1 CORNER INDICATOR (NC) SOLDER BALL
OZ6933-SF-1.7
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