WS512K32V Datasheet, PDF (1/8 Pages) List of Unclassifed Manufacturers – 512Kx32 SRAM 3.3V MODULE

WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE PRELIMINARY*
FEATURES
s Access Times of 15, 17, 20ns
s Low Voltage Operation
s Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high,
(Package 509)
• 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U),
3.56mm (0.140") high, (Package 519)
s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8
s Commercial, Industrial and Military Temperature Ranges
s Low Voltage Operation:
• 3.3V ± 10% Power Supply
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Fully Static Operation:
• No clock or refresh required.
s Three State Output.
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32V-XG1UX - 5 grams typical
WS512K32NV-XH1X - 13 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
PIN CONFIGURATION FOR WS512K32NV-XH1X
TOP VIEW
1
12
23
I/O8
WE2
I/O15
34
45
56
I/O24
VCC
I/O31
I/O9
CS2
I/O14
I/O25
CS4
I/O30
I/O10
GND
I/O13
I/O26
WE4
I/O29
A13
I/O11
I/O12
A6
I/O27
I/O28
A14
A10
OE
A7
A3
A0
A15
A11
A18
NC
A4
A1
A16
A12
WE1
A8
A5
A2
A17
VCC
I/O7
I/O0
CS1
I/O6
A9
I/O16
WE3
CS3
I/O23
I/O22
OE
A0-18
I/O1
NC
I/O5
I/O17 GND
I/O21
I/O2
I/O3
I/O4
11
22
33
I/O18
I/O19
I/O20
44
55
66
PIN DESCRIPTION
I/O0-31
A0-18
WE1-4
CS1-4
OE
VCC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E1C S 1
W E2 C S2
W E3 C S 3
W E 4C S4
512K x 8
8
I/O0-7
512K x 8
8
I/O8-15
512K x 8
8
I/O16-23
512K x 8
8
I/O24-31
May 2001 Rev. 6
1
White Electronic Designs Corporation • [phone] • www.whiteedc.com