HPL5331 Datasheet, PDF (1/20 Pages) List of Unclassifed Manufacturers – 3A Bus Termination Regulator

HPL5331
3A Bus Termination Regulator
Features
General Description (Cont.)
• Provide Bi-direction Current
- Sourcing or Sinking Current up to 3A
• 1.25V/0.9V Output for DDR I/II Applications
• Fast Transient Response
• High Output Accuracy
- ±20mV over Load, VOUT Offset and
Temperature
• Adjustable Output Voltage by External Resistors
• Current-Limit Protection
• On-Chip Thermal Shutdown
• Shutdown for Standby or Suspend Mode
On-chip thermal shutdown provides protection against
any combination of overload that would create ex-
cessive junction temperature. The output voltage of
HPL5331 track the voltage at VREF pin. A resistor
divider connected to VIN, GND and VREF pins is
used to provide a half voltage of VIN to VREF pin. In
addition, an external ceramic capacitor and an open-
drain transistor connected to VREF pin provides soft-
start and shutdown control respectively. Pulling and
holding the VREF to GND shuts off the output. The
output of HPL5331 will be high impedance after being
shut down by VREF or thermal shutdown function.
• Simple SOP-8, SOP-8-P with thermal pad,
TO-252- 5 and TO-263-5 Packages
Pin Configuration
Applications
• DDR I/II SDRAM Termination
• SSTL-2/3 Termination Voltage
• Applications Requiring the Regulator with
Bi-direction 3A Current Capability
General Description
The HPL5331 linear regulator is designed to provide a
regulated voltage with bi-directional output current for
DDR-SDRAM termination. The HPL5331 integrates
two power transistors to source or sink current up to
3A. It also incorporate current-limit, thermal shutdown
and shutdown control functions into a single chip. Cur-
rent-limit circuit limits the short-circuit current.
VIN 1
GND 2
VREF 3
VOUT 4
8 VCNTL
7 VCNTL
TAB is VCNTL
6 VCNTL
5 VCNTL
VOUT
VREF
VCNTL
GND
VIN
SOP-8 (Top View)
TO-252-5 (Top View)
VIN ₁
GND ₂
VREF 3
VOUT ₄
8 NC
7 NC
TAB is VCNTL
6 VCNTL
5 NC
5
VOUT
4
VREF
3
VCNTL
2
GND
1
VIN
SOP-8-P (Top View) TO-263-5 (Top View)
NC = No internal connection
= Thermal Pad
(connected to GND plane for better heat
dissipation)
 Copyright HIPAC Semiconductor, Inc.
1
Rev. A.8 - Oct., 2003
www.hipacsemi.com