S1C17555 Datasheet, PDF (2/5 Pages) Epson Company – 16-bit Single Chip Microcontroller

S1C17555/565/955/965
12-bit A/D converter (aDC12Sa)
Conversion method
–
Successive
–
approximation type
Successive
approximation type
Analog input channel
–
6 channels
–
(Three channels can
6 channels
(Three channels can
only be used for
multichannel
only be used for
multichannel
conversion.)
conversion.)
Resolution
–
12 bits
–
12 bits
Interrupts
Reset interrupt
#RESET pin
NMI
Watchdog timer
Programmable interrupts
21 systems (8 levels)
22 systems (8 levels)
21 systems (8 levels)
22 systems (8 levels)
Power supply voltage
Core voltage (LVDD)
1.65 V to 1.95 V
1.65 V to 1.95 V
(Not required when the
1.65 V to 1.95 V
1.65 V to 1.95 V
(Not required when the
regulator is used)
regulator is used)
I/O voltage (HVDD)
1.65 V to 3.6 V
2.0 V to 3.6 V
(When the regulator is
used)
1.65 V to 3.6 V
2.0 V to 3.6 V
(When the regulator is
used)
1.65 V to 3.6 V
1.65 V to 3.6 V
(When the regulator is
not used)
(When the regulator is
not used)
Analog voltage (AVDD)
–
2.7 V to 3.6 V (Not
–
required when the
2.7 V to 3.6 V (Not
required when the
regulator is used)
regulator is used)
Flash programming voltage
(VPP)
7.5 V (Not required when the regulator/booster is used.)
Regulators
LVDD regulator
–
Input: 2.0 V to 3.6 V
–
Output: 1.8 V
Input: 2.0 V to 3.6 V
Output: 1.8 V
AVDD regulator
–
Input: 3.1 V to 3.6 V,
–
Output: 2.8 V
Input: 3.1 V to 3.6 V,
Output: 2.8 V
VPP regulator/booster
Input: 2.4 V to 3.6 V
Output: 7.5 V
Operating temperature
Operating temperature range -40°C to 85°C (10 to 40°C when programing/erasing the Flash)
Current consumption (Typ. value, lVDD = hVDD = 1.8 V, regulator not used)
SLEEP state
1.0 μA (IOSC = Off, OSC1 = Off, OSC3 = Off)
HALT state
2.9 μA (IOSC = Off, OSC1 = 32 kHz, OSC3 = Off)
Run state
3500 μA (IOSC = 12 MHz, OSC1 = Off, OSC3 = Off)
FSA operating current
-
+270 μA/MHz
Shipping form
1
WCSP-48
TQFP13-64pin
WCSP-48
TQFP13-64pin
3.863 × 3.863 × 0.8 mm, 10 × 10 × 1.0 mm,
ball pitch: 0.5 mm
lead pitch: 0.5 mm
3.863 × 3.863 × 0.8 mm, 10 × 10 × 1.0 mm,
ball pitch: 0.5 mm
lead pitch: 0.5 mm
2
Die form
Die form
3.863 × 3.863 mm,
3.863 × 3.863 mm,
pad pitch: 140 μm
pad pitch: 140 μm
*1 For more information on the FSA, please contact Seiko Epson.
2
Seiko Epson Corporation