G1540 Datasheet, PDF (13/21 Pages) Global Mixed-mode Technology Inc – Low Power Quadruple Operational Amplifiers

Temperature measurement
Glass-encapsulated sensors
Solder joint profiles for silver/nickel/tin terminations
B57540G1
G1540
1.3.3 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size A
B
C
inch/mm
0402/1005 0.6
0.6
1.7
0603/1608 1.0
1.0
3.0
0805/2012 1.3
1.2
3.4
1206/3216 1.8
1.2
4.5
1.3.4 Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and
Important notes at the end of this document.
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