EN25LF40_1 Datasheet, PDF (35/35 Pages) Eon Silicon Solution Inc. – 4 Megabit Serial Flash Memory with 4Kbytes Uniform Sector

Revisions List
EN25LF40
Revision No Description
Date
A
Initial release
2008/04/09
1. Change the Vcc from 2.5~3.6V to 2.35~3.6V
B
2. Remove the 100MHz description and Table 10.100MHz AC
2008/05/16
Characteristics on page 1, 22, 23 and 30
C
Remove C grade option of temperature range on page 1 and page 31 2008/06/23
1. Add Eon products’ New top marking “cFeon“ information on page 1.
2. Add the description “Serial Interface Architecture “and modify active
current (typical) from 5mA to 12mA on page 2.
3. List the Note 4 for 90h command in Table 4 on page 10.
4. Update Table 6. Status Register Bit Locations on page 12.
5. Add Table 7. OTP Sector Address on page 23.
6. Add Note “ Vcc (max) is 3.6V and Vcc (min) is 2.7V “ in Table 8 on
page 24.
D
7. Modify ICC3 from "Q = open" to " DQ = open " in Table 9 on page 25 _2008/12/18
8. Correct the typo “tCLH to tCH” “tCLL to tCL” ”tHHQZ to tHHQX”
in Table 11 on page 26.
9. Modify Storage Temperature from "-65 to + 125" to "-65 to +150"
on page 28
10. Delete Latch up Characteristics Table from version C.
11.Modify official name from 209mil to 208mil and delete dimension
" c " in Figure 27 on page 31.
12. Modify Figure 27. VDFN8 ( 5x6mm ) dimension A from 0.80 to 0.75
on page 32.
1. Update Page program, Sector, Block and Chip erase time (typ.)
parameter on page 2 and 25.
(1). Page program: from 1.5ms to 1.3ms
(2). Sector erase: from 0.15s to 0.09s
E
(3). Block erase: from 0.8s to 0.5s
(4). Chip erase: from 5s to 3.5s
2009/07/07
2. Update the Protected Area Sizes definition of BP2 BP1 and BP0
in table 3 on page 8.
3. Add the description of OTP erase command on page 9 and page 23.
4. Remove the Block Erase “52h” command on page 9, 17 and 18.
1. Change the Vcc from 2.35~3.6V to 2.3~3.6V
F
2. Modify Page Program time: from 5ms (max.) 7ms (max.),
2010/02/08
Block Erase time: from 2ms (max.) 2.5ms (max.) on page 26.
G
Modify D2 of VDFN8(5x6) from 4.23 to 3.40 on page 32.
2010/05/31
This Data Sheet may be revised by subsequent versions
35
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc.,
Rev. G, Issue Date: 2010/05/31
www.eonssi.com