H4006 Datasheet, PDF (10/10 Pages) EM Microelectronic - MARIN SA – 13.56MHz 64 Data bit Read Only Contactless Identification Device

EM MICROELECTRONIC-MARIN SA H4006
Pad position
137 339
189 259
160
141
VSS
TESTn TOUT VDD
H4006
1600
CID package
FRONT VIEW
TOP VIEW
4±0.2
C1
317
150
1041
Dimensions in µm
C2
150
PCB package
4.0 mm
1.0 mm max.
8.0 mm
EM
Coil2 Coil1
Dimensions in mm
MARKING
AREA
R0.5±0.1
0.5±
0.12
Coil2 Coil1
1.3±
0.05
1.3±
0.05
0.4±0.1
Dimensions in mm
Ordering Information
The H4006 is available in :
- Chip form *
H4006 501 IC
- CIDpack
H4006 501 CID
- PCB package
H4006 501 COB
*Chip will be delivered in wafer form.
Thickness of the wafer: 180 µm ± 20 µm (7 mils)
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely
embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the
specifications without notice at any time. You are strongly urged to ensure that the information given has not been
superseded by a more up to date version.
© 1997 EM Microelectronic-Marin SA, 01/98 Rev. A/194
10
EM MICROELECTRONIC-MARIN SA CH-2074 Marin, Switzerland Tel. [phone], Fax. [phone]