EMLS232UA Datasheet, PDF (3/14 Pages) Emerging Memory & Logic Solutions Inc – 512K x 32 x 4Banks Low Power SDRAM Specificaton

General Wafer Specifications
¦ _{Process Technology : 0.125um Trench DRAM Process}
¦ _{Wafer thickness : 725 +/- 25um}
¦ _{Typical Pad Open Size : 70.2um x 70.2um}
¦ _{Minimum Pad Pitch : 93.6um}
¦ _{Wafer Diameter : 8-inch}
EMLS232UA Series
512K x 32 x 4Banks Low Power SDRAM
Rev 0.6