EMP216MEAF Datasheet, PDF (15/15 Pages) Emerging Memory & Logic Solutions Inc – 2Mx16 Pseudo Static RAM

PACKAGE DIMENSION
48 Ball Fine Pitch BGA (0.75mm ball pitch)
A1 corner index area
Top View
B
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
Bottom View
B
B1
6 5 4 3 21
A
B
C
D
E
F
G
H
A1 index Mark
Side View
4 _{E2(Seating plane)}
A
3 _D(Diameter)
C
5
C
B/2
Detail A
A
R
Min.
A
-
B
5.90
B1
-
C
7.90
C1
-
D
0.30
E
-
E1
-
E2
0.20
R
-
Typ.
0.75
6.00
3.75
8.00
5.25
0.35
1.00
0.75
0.25
-
Max.
-
6.10
-
8.10
-
0.40
1.10
-
0.30
0.08
NOTES
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. All dimensions are millimeters.
3. Dimension “D” is measured at the maximum solder ball
diameter in a plane parallel to datum C.
4. Primary datum C (Seating plane) is defined by the crown
of the solder balls.
5. This is a controlling dimension.
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Rev 0.0