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MMBT2222 Datasheet, PDF (2/2 Pages) Samsung semiconductor – NPN (GENERAL PURPOSE TRANSISTOR)
Switching Transistors
MMBT2222, MMBT2222A
Characteristics (Tj = 25°C)
Base saturation voltage – Basis-Sättigungsspannung 1)
IC = 150 mA, IB = 15 mA
MMBT2222
MMBT2222A
VBEsat
VBEsat
IC = 500 mA, IB = 50 mA
MMBT2222
MMBT2222A
VBEsat
VBEsat
DC current gain – Kollektor-Basis-Stromverhältnis 1)
VCE = 10 V, IC = 0.1 mA
hFE
VCE = 10 V, IC = 1 mA
hFE
VCE = 10 V, IC = 10 mA
hFE
VCE = 10 V, IC = 150 mA
hFE
VCE = 1 V, IC = 150 mA
hFE
VCE = 10 V, IC = 500 mA
hFE
h-Parameters at VCE = 10V, f = 1 kHz, IC = 1 mA / 10 mA 2)
Small signal current gain
MMBT2222
hfe
Kleinsignal-Stromverstärkung MMBT2222A hfe
Input impedance
Eingangs-Impedanz
MMBT2222
hie
MMBT2222A hie
Output admittance
Ausgangs-Leitwert
MMBT2222
hoe
MMBT2222A hoe
Gain-Bandwidth Product – Transitfrequenz
VCE = 10 V, IC = 10 mA, f = 100 MHz
fT
Collector-Base Capacitance – Kollektor-Basis-Kapazität
VCB = 10 V, IE = ie = 0, f = 1 MHz
CCB0
Emitter-Base Capacitance – Emitter-Basis-Kapazität
VEB = 0.5 V, IC = ic = 0, f = 1 MHz
CEB0
Noise figure – Rauschzahl
VCE = 10 V, IC = 100 µA,
RS = 1 kΩ, f = 1 kHz
MMBT2222A
F
Switching times – Schaltzeiten
delay time
rise time
VCC = 30 V, - VBE = 0.5 V
td
IC = 150 mA, IB1 = 15 mA
tr
storage time
VCC = 30 V, IC = 150 mA
ts
fall time
IB1 = - IB2 = 15 mA
tf
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
–
–
600 mV
–
–
–
–
–
1.3 V
1.2 V
2.6 V
2V
35
–
–
50
–
–
75
–
–
100
–
300
50
–
–
40
–
–
50
–
300
75
–
375
2 kΩ
–
8 kΩ
0.25 kΩ
–
1.25 kΩ
5 µS
25 µS
–
35 µS
–
200 µS
250 MHz
–
–
–
4 pF
8 pF
–
20 pF
25 pF
–
–
4 dB
–
–
10 ns
–
–
25 ns
–
–
225 ns
–
–
60 ns
RthA
420 K/W 3)
Recommended complementary PNP transistors
Empfohlene komplementäre PNP-Transistoren
MMBT2907, MMBT2907A
Marking - Stempelung
MMBT2222 = (M)1B
MMBT2222A = 1P
1) Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
2) MMBT2222: IC = 1 mA, MMBT2222A: IC = 10 mA
3) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
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