AP7167_10 Datasheet, PDF (4/14 Pages) Diodes Incorporated – 1.2A LOW DROPOUT REGULATOR WITH POK

AP7167
1.2A LOW DROPOUT REGULATOR WITH POK
Electrical Characteristics
(T_A = 25^oC, V_IN = V_OUT +1V, C_IN = 1µF, C_OUT = 10µF, V_EN = V_IN, unless otherwise stated)
Symbol
Parameter
Test Conditions
Min
I_Q
Input Quiescent Current
I_OUT= 0
⎯
I_SHDN
Input Shutdown Current
V_EN = 0V, I_OUT = 0 (Note 3)
-1
V_Dropout
Dropout Voltage
V_OUT ≥ 1.5V, I_OUT = 0.5A
V_OUT ≥ 1.5V, I_OUT = 1A
V_REF
FB reference voltage
I_FB
FB leakage
⎯
V_OUT
Output Voltage Total Accuracy
Over line, load and
temperature
-3
/ ^ΔVOUT VOUT Line Regulation
ΔVIN
V_IN = V_OUT +1V to 5.5V,
I_OUT = 1mA
ΔV_OUT / V_OUT
t_ST
PSRR
I_LIMIT
I_SHORT
V_IL
V_IH
I_EN
V_OL
V_{POK_TH_UP}
Load Regulation
Start-up Time, from EN high to POK
high
Power Supply Rejection Ratio
Current limit
Short-circuit Current
I_OUT from 1mA to 1A
V_EN = 0V to 2.0V, I_OUT =
100mA, V_IN = 3.3V
1kHz, V_IN = 3.3V, V_OUT = 1.2V,
I_OUT = 100mA
V_OUT = 1.8V, R_OUT = 0.5Ω
V_IN = 3.3V, V_OUT < 0.2V
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input leakage
V_EN = 0V or 5.5V
POK output low voltage
Force 2mA
Output
voltage
(rising)
POK
threshold
FB (or
rising
OUT
for
fixed
version)
-1.5
1.2
1.4
⎯
87%
V_{POK_Hys}
Output voltage POK hysteresis
POK deglitch
V_IN = 3.3V, V_OUT = 1.2V
I_{POK_LK}
POK leakage current
V_POK = 5.5V
⎯
T_SHDN
Thermal shutdown threshold
T_HYS
Thermal shutdown hysteresis
Thermal Resistance Junction-to-
DFN3030-10 (Note 4)
θ_JA
Ambient
SOP-8L-EP (Note 5)
Typ.
125
0.1
230
500
0.8
0.01
0.02
190
60
1.6
750
0.01
100
92%
4%
160
0.01
155
25
40
27
Max
180
1
800
1
3
1.5
0.4
1
200
97%
1
Unit
µA
µA
mV
mV
V
µA
%
%/V
%
µs
dB
A
mA
V
V
µA
mV
V_ref
V_ref
µs
µA
°C
°C
o_C/W
o_C/W
Notes:
3. POK pin must be disconnected from IN pin.
4. Test condition for DFN3030-10: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 6 vias to
bottom layer 1.0”x1.5” ground plane.
5. Test condition for SOP-8L-EP: Device mounted on 2" x 2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
Typical Performance Characteristics
AP7167
Document number: DS31252 Rev. 7 - 2
4 of 14
www.diodes.com
September 2010
© Diodes Incorporated