APX809 Datasheet, PDF (3/9 Pages) Diodes Incorporated – 3-PIN MICROPROCESSOR RESET CIRCUITS

APX809/810
3-PIN MICROPROCESSOR RESET CIRCUITS
Recommended Operating Conditions
Symbol
Parameter
ESD HBM Human Body Model ESD Protection
ESD MM Machine Model ESD Protection
V_CC Supply Voltage
V_IN Input Voltage
T_A Operating Ambient Temperature Range
T_R Vcc Rising Time (Vcc = 0~VT)
Min
Max
5
500
1.1
5.5
0
(V_CC+0.3)
-40
85
100
Unit
KV
V
V
V
o_C
V/ uS
Electrical Characteristics (T_A = 25ºC)
T_A= -40 to 85 ^oC unless otherwise note. Typical values are at T_A=+25 ^oC.
Symbol
Parameter
Test Conditions
V_CC V_CC Range
T_A = 0^oC to +70^oC
I_CC Supply Current
V_TH + 0.2V
APX809/810-23
APX809/810-26
APX809/810-29
APX809/810-31 T_A = 0^oC-85^oC
APX809/810-40
APX809/810-44
Reset
APX809/810-46
V_TH Threshold APX809/810-23
APX809/810-26
APX809/810-29
APX809/810-31 T_A = -40^oC-85^oC
APX809/810-40
APX809/810-44
APX809/810-46
Reset Threshold Tempco
T_S
T_DELAY
V_OL
V_OH
V_OL
V_OH
θ_JA
Set-up Time
Reset Active Timeout Period
RESET Output Voltage Low
(APX809)
RESET Output Voltage-High
(APX809)
RESET Output Voltage-Low
(APX810)
RESET Output Voltage-High
(APX810)
Thermal Resistance
Junction-to-Ambient
V_CC = V_TH to (V_TH – 100mV)
T_A = 0^oC to +85^oC
V_CC = V_TH -0.2, I_SINK = 1.2mA
V_CC = V_TH -0.2, I_SINK = 3.2mA
V_CC > 1.0V, I_SINK = 50uA
V_CC > V_TH +0.2,
I_SOURCE = 500uA
V_CC > V_TH +0.2,
I_SOURCE = 800uA
V_CC = V_TH +0.2, I_SINK = 1.2mA
V_CC = V_TH +0.2, I_SINK = 3.2mA
1.8V < V_CC < V_TH -0.2,
I_SOURCE = 150uA
SOT23/SOT23R (Note 3)
θ_JC
Thermal Resistance
Junction-to-Case
SOT23/SOT23R (Note 3)
Min
1.0
2.21
2.59
2.88
3.02
3.93
4.31
4.56
2.20
2.57
2.86
3.00
3.92
4.29
4.54
140
0.8V_CC
V_CC –1.5
0.8 V_CC
Typ
30
2.25
2.63
2.93
3.08
4.00
4.38
4.63
2.25
2.63
2.93
3.08
4.00
4.38
4.63
30
20
200
201
56
Max Unit
5.5
V
40
μA
2.30
2.69
3.00
3.15
V
4.08
4.47
4.72
2.30
2.69
3.00
3.15 V
4.08
4.47
4.72
ppm/ ^oC
μs
280 ms
0.3
0.4
V
0.3
V
0.3
0.4
V
V
o_C/W
o_C/W
Notes: 3. Test condition for SOT23/ SOT23R: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
APX809/810 Rev. 3
3 of 9
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MARCH 2008
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