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DVRN6056_10 Datasheet, PDF (1/5 Pages) Diodes Incorporated – VOLTAGE REFERENCE ARRAY
Features
• Epitaxial Planar Die Construction
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant Version (Notes 2 & 3)
• “Green” Device (Note 3)
DVRN6056
VOLTAGE REFERENCE ARRAY
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, “Green” Molding Compound
(Note 3) UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Matte Tin Finish annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.008 grams (approximate)
Top View
K1
NC
E1
Z1
Q1
A1
B1
C1
Device Schematic
Maximum Ratings, NPN Transistor Element (Q1) @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
60
V
Collector-Emitter Voltage
VCEO
40
V
Emitter-Base Voltage
VEBO
6.0
V
Collector Current - Continuous
(Note 1)
IC
600
mA
Maximum Ratings, Zener Element (Z1) @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
PD
RθJA
TJ, TSTG
Value
300
417
-55 to +150
Unit
mW
°C/W
°C
Notes:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Product manufactured with date code WN (Week 45, 2009) and newer are built with Green Molding Compound and Lead-free plating. Product
manufactured prior to date code WO are built with Tin-Lead plating, Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DVRN6056
Document number: DS30556 Rev. 5 - 2
1 of 5
www.diodes.com
March 2010
© Diodes Incorporated