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DDTC114GUA_2 Datasheet, PDF (1/3 Pages) Diodes Incorporated – NPN PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
DDTC (R2-ONLY SERIES) UA
NPN PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary PNP Types Available (DDTA)
• Built-In Biasing Resistor, R2 only
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
A
C
BC
SOT-323
Dim Min
Max
A
0.25
0.40
B
1.15
1.35
Mechanical Data
B
E
C
2.00
2.20
• Case: SOT-323
G
• Case Material: Molded Plastic, "Green" Molding
H
D
0.65 Nominal
E
0.30
0.40
Compound, Note 4. UL Flammability Classification
Rating 94V-0
K
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
J
• Terminals: Solderable per MIL-STD-202, Method 208
DE
L
G
1.20
1.40
M
H
1.80
2.20
J
0.0
0.10
K
0.90
1.00
• Lead Free Plating (Matte Tin Finish annealed over
L
0.25
0.40
Alloy 42 leadframe).
C
• Marking: Date Code and Type Code, See Page 3
B
M
0.10
0.18
• Ordering Information: See Page 3
• Type Code: See Table Below
• Weight: 0.006 grams (approximate)
R2
E
α
0°
8°
All Dimensions in mm
P/N
DDTC114GUA
DDTC124GUA
DDTC144GUA
DDTC115GUA
R2 (NOM)
10KΩ
22KΩ
47KΩ
100KΩ
Type Code
N26
N27
N28
N29
SCHEMATIC DIAGRAM
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
VCBO
VCEO
VEBO
IC (Max)
Pd
RθJA
Tj, TSTG
50
50
5
100
200
625
-55 to +150
V
V
V
mA
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout as shown on Diodes Inc., suggested pad layout document AP02001, which can be found on
our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to date code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30324 Rev. 7 - 2
1 of 3
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