DDTA113TE_2 Datasheet, PDF (1/4 Pages) Diodes Incorporated – PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR

DDTA (R1-ONLY SERIES) E
PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary NPN Types Available (DDTC)
• Built-In Biasing Resistor, R1 only
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
A
C
TOP VIEW B C
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Terminal Connections: See Diagram
• Marking & Date Code Information: See Diagrams
& Page 4
• Ordering Information: See Page 4
• Weight: 0.002 grams (approximate)
P/N
DDTA113TE
DDTA123TE
DDTA143TE
DDTA114TE
DDTA124TE
DDTA144TE
DDTA115TE
DDTA125TE
R1 (NOM)
1KΩ
2.2KΩ
4.7KΩ
10KΩ
22KΩ
47KΩ
100KΩ
200KΩ
MARKING
P01
P03
P07
P12
P16
P19
P23
P25
B
E
G
H
K
N
M
J
D
L
R₁
C
B
E
SCHEMATIC DIAGRAM
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D ⎯ ⎯ 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
α 0° 8° ⎯
All Dimensions in mm
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
V_CBO
V_CEO
V_EBO
I_C (Max)
P_d
R_θJA
T_j, T_STG
-50
-50
-5
-100
150
833
-55 to +150
V
V
V
mA
mW
°C/W
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout as shown on Diodes Inc., suggested pad layout document AP02001, which can be found on
our website at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30319 Rev. 6 - 2
1 of 4
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