BC857BV Datasheet, PDF (1/3 Pages) NXP Semiconductors – PNP general purpose double transistor

SPICE MODEL: BC857BV
BC857BV
Pb
Lead-free _{PNP DUAL SMALL SIGNAL SURFACE MOUNT}
TRANSISTOR
Features
· Epitaxial Die Construction
· Complementary NPN Types Available
(BC847BV)
· Ultra-Small Surface Mount Package
· Lead Free By Design/RoHS Compliant (Note 3)
Mechanical Data
· Case: SOT-563
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
· Moisture sensitivity: Level 1 per J-STD-020C
· Terminal Connections: See Diagram
· Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
· Marking (See Page 2): K5V
· Ordering & Date Code Information: See Page 2
· Weight: 0.003 grams (approximate)
A
C₁
B₂
E₂
K5V YM ^B C
E₁
B₁
C₂
D
G
K
M
H
L
SEE NOTE 1
C₁
B₂
E₂
SOT-563
Dim Min Max Typ
A 0.15 0.30 0.25
B 1.10 1.25 1.20
C 1.55 1.70 1.60
D
0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
K 0.56 0.60 0.60
L 0.10 0.30 0.20
M 0.10 0.18 0.11
All Dimensions in mm
E₁
B₁
C₂
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage Temperature Range
Symbol
VCBO
V_CEO
VEBO
I_C
Pd
R_qJA
Tj, TSTG
Value
-50
-45
-5.0
-100
150
833
-55 to +150
Notes:
1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
Unit
V
V
V
mA
mW
°C/W
°C
DS30433 Rev. 3 - 2
1 of 3
www.diodes.com
BC857BV
ã Diodes Incorporated