DTP4N60_13 Datasheet, PDF (8/11 Pages) DinTek Semiconductor Co,.Ltd – Power MOSFET Reduced Gate Drive Requirement

TO-220 FULLPAK (HIGH VOLTAGE)
E
n
ØP
Package Information
www.din-tek.jp
A
A1
d1
d3
D
u
L1
V
L
b
e
b3
b2
MILLIMETERS
DIM.
MIN.
MAX.
A
4.570
4.830
A1
2.570
2.830
A2
2.510
2.850
b
0.622
0.890
b2
1.229
1.400
b3
1.229
1.400
c
0.440
0.629
D
8.650
9.800
d1
15.88
16.120
d3
12.300
12.920
E
10.360
10.630
e
2.54 BSC
L
13.200
13.730
L1
3.100
3.500
n
6.050
6.150
ØP
3.050
3.450
u
2.400
2.500
v
0.400
0.500
ECN: X09-0126-Rev. B, 26-Oct-09
DWG: 5972
Notes
1. To be used only for process drawing.
2. These dimensions apply to all TO-220, FULLPAK leadframe versions 3 leads.
3. All critical dimensions should C meet C_pk > 1.33.
4. All dimensions include burrs and plating thickness.
5. No chipping or package damage.
A2
c
MIN.
0.180
0.101
0.099
0.024
0.048
0.048
0.017
0.341
0.622
0.484
0.408
0.520
0.122
0.238
0.120
0.094
0.016
INCHES
0.100 BSC
MAX.
0.190
0.111
0.112
0.035
0.055
0.055
0.025
0.386
0.635
0.509
0.419
0.541
0.138
0.242
0.136
0.098
0.020
1