DA14581_16 Datasheet, PDF (4/153 Pages) Dialog Semiconductor – Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

DA14581
Bluetooth Low Energy 4.2 SoC with Optimized Boot Time
FINAL
2 Pinout
The DA14581 comes in three packages:
• A Wafer Level Chip Scale Package (WLCSP) with
34 balls (normal thickness and ultra-thin)
• A Quad Flat Package No Leads (QFN) with 40 pins
The actual pin/ball assignment is depicted in the follow-
ing figures:
1
2
3
4
5
6
A
B
XTAL16Mm
XTAL16Mp
VDCDC_RF
P1_3
RFIOm
RFIOp
GND
GND
P0_1
VPP
P0_0
C
SW_CLK
P1_2
GND
P0_2
P0_3
D
SWDIO
P1_1
GND
GND
P0_4
P0_5
E
VBAT1V
P1_0
RST
VBAT_RF
P0_7
P0_6
F
SWITCH
VDCDC
GND
VBAT3V
XTAL32Kp
XTAL32Km
DA14581 (Top View)
Figure 2: WLCSP Ball Assignment
P0_0
1
P0_1
2
P0_2
3
P0_3
4
NC
5
P0_4
6
P0_5
7
P2_1
8
P0_6
9
P0_7
10
DA14581
(Top View)
30
XTAL16Mm
29
XTAL16Mp
28
P1_3
27
P1_2
26
SW_CLK
25
SWDIO
24
P1_1
23
VBAT1V
22
P1_0
21
SWITCH
Pin 0: GND
plane
Figure 3: QFN40 Pin Assignment
Datasheet
CFR0011-120-01
Revision 3.2
4 of 153
17-Jan-2017
© 2014 Dialog Semiconductor