CD4148WTP Datasheet, PDF (4/6 Pages) Mospec Semiconductor – Small-Signal Chip Diode

CD4148WTP
APPLICATIONS
Function: suit for small signal switching application
Typical Application circuit:
Typical Product field: General application except high reverse voltage location
Soldering Condition:
Soldering Condition & Caution
■ Recommended Soldering Condition
(Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition
Sn-Pb Soldering
Ramp-up rate (from pre-heat stage)
Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature
Time within 5^oC of peak temperature
Ramp-down rate
Time 25^oC to peak temperature
<3^oC/s
100-150 ^oC
60-120s
183 ^oC
60-150s
230±5^oC
<260^oC
10-20s
<6^oC/s
<6min
Leadfree
Soldering
<3^oC/s
150-200 ^oC
60-120s
217 ^oC
60-150s
245±5^oC
<260^oC
20-30s
<6^oC/s
<8min
Wave Soldering
△T<150^oC
100-150 ^oC
60-120s
260±5^oC
5±2s
260±5^oC
-
<6^oC/s
-
Manual Soldering: Approx. 350^oC for 3s, avoid solder iron tip direct touch the components body
4