English
Language : 

DS1221 Datasheet, PDF (5/8 Pages) Dallas Semiconductor – Nonvolatile Controller x 4 Chip
CAPACITANCE
PARAMETER
Input Capacitance
Output Capacitance
SYMBOL
CIN
COUT
MIN
AC ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL MIN
CE Propagation Delay
tPD
5
CE High to Power-Fail
tPF
Address Setup
tAS
20
PARAMETER
Recovery at Power-Up
VCC Slew Rate 4.5 - 4.25V
VCC Slew Rate 4.25 - 3V
VCC Slew Rate 4.25 - 4.5V
CE Pulse Width
SYMBOL
tREC
tF
tFB
tR
tCE
NOTES:
1. All voltages are referenced to ground.
2. Only one battery input is required.
MIN
2
300
10
0
TYP
MAX
5
7
DS1221
(tA = 25°C)
UNITS NOTES
pF
pF
(0°C to 70°C; VCC = 4.5 to 5.5V)
TYP
MAX UNITS NOTES
15
25
ns
5
0
ns
ns
9
(0°C to 70°C; VCC < 4.5V)
TYP
MAX UNITS NOTES
5
10
ms
µs
µs
µs
1.5
µs
7, 8
3. Measured with VCCO and CE0 - CE3 open.
4. ICCO1 is the maximum average load which the DS1221 can supply to the memories.
5. Measured with a load as shown in Figure 4.
6. ICCO2 is the maximum average load current which the DS1221 can supply to the memories in the
battery back-up mode.
7. Chip enable outputs CE0 - CE3 can only sustain leakage current in the battery back-up mode.
8. tCE max. must be met to ensure data integrity on power loss.
9. tAS is only required to keep the decoder outputs glitch-free. While CE is low, the outputs ( CE0 - CE3 )
will be defined by inputs A and B with a propagation delay of tPD from an A or B input change.
10. For applications where higher currents are required, please see the DS1259 Battery Manager Chip
data sheet.
5 of 8