DS1554 Datasheet, PDF (19/21 Pages) Dallas Semiconductor – 256K NV Y2KC Timekeeping RAM

DS1554P
DS1554
PKG
DIM
A
B
C
D
E
F
G
INCHES
MIN NOM MAX
0.920
0.980
-
0.052
0.048
0.015
0.025
0.925
0.985
-
0.055
0.050
0.020
0.027
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE:
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live-bug”).
Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux,
heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
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