MTB020N03V8 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – N -Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN3×3 Dimension
Spec. No. : C737V8
Issued Date : 2017.03.06
Revised Date :
Page No. : 9/9
Marking:
D D DD
B020
Date ^N03
Code
S SSG
8-Lead DFN3×3 Plastic Package
CYStek Package Code: V8
*: Typical
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.605 0.850 0.026 0.033
b
0.200 0.400 0.008 0.016
A1
0.152 REF
0.006 REF
e
0.550 0.750 0.022 0.030
A2 0.000 0.050 0.000 0.002
L
0.300 0.500 0.012 0.020
D
2.900 3.100 0.114 0.122
L1 0.180 0.480 0.007 0.019
D1 2.300 2.600 0.091 0.102 L2 0.000 0.100 0.000 0.004
E
2.900 3.100 0.114 0.122
L3 0.000 0.100 0.000 0.004
E1 3.150 3.450 0.124 0.136
H
0.315 0.515 0.012 0.020
E2 1.535 1.935 0.060 0.076
θ
9°
13°
9°
13°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB020N03V8
CYStek Product Specification