BTB818AG6 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – Low Vcesat PNP Epitaxial Planar Transistor

CYStech Electronics Corp.
TSOP-6 Dimension
Spec. No. : C240G6
Issued Date : 2013.05.03
Revised Date : 2013.08.29
Page No. : 9/9
Marking:
Device Code
AF
Date Code
6-Lead TSOP-6 Plastic
Surface Mounted Package
CYStek Package Code: G6
Style:
Pin 1. Collector (C)
Pin 2. Collector (C)
Pin 3. Base (B)
Pin 4. Emitter (E)
Pin 5. Collector (C)
Pin 6. Collector (C)
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A 0.1063 0.1220 2.70
3.10
G
0
0.0039
0
0.10
B 0.1024 0.1181 2.60
3.00
H
-
0.0098
-
0.25
C 0.0551 0.0709 1.40
1.80
I
0.0047 REF
0.12 REF
D
0.0748 REF
1.90 REF
J
0.0177 REF
0.45 REF
d1
0.0374 REF
0.95 REF
K
0.0236 REF
0.60 REF
d2
0.0374 REF
0.95 REF
L
0°
10°
0°
10°
E 0.0118 0.0197 0.30
0.50
M
-
0.0433
-
1.10
F 0.0276 0.0394 0.70
1.00
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB818AG6
CYStek Product Specification