HBNP5213N6 Datasheet, PDF (8/8 Pages) Cystech Electonics Corp. – NPN AND PNP Dual Epitaxial Planar Transistors

CYStech Electronics Corp.
SOT-23-6L Dimension
Spec. No. : C627N6
Issued Date : 2013.10.17
Revised Date :
Page No. : 8/8
Marking:
Device Code
5213
□□□□
Date Code
6Lead SOT-23-6L Plastic
Surface Mounted Package
CYStek Package Code: N6
Style:
Pin 1. Base 1 (B1)
Pin 2. Emitter 2 (E2)
Pin 3. Base 2 (B2)
Pin 4. Collector 2 (C2)
Pin 5. Emitter 1 (E1)
Pin 6. Base 1 (B1)
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
1.050 1.250 0.041 0.049
E
1.500 1.700 0.059 0.067
A1 0.000 0.100 0.000 0.004 E1 2.650 2.950 0.104 0.116
A2 1.050 1.150 0.041 0.045
e
0.950 (BSC)
0.037 (BSC)
b
0.300 0.500 0.012 0.020 e1 1.800 2.000 0.071 0.079
c
0.100 0.200 0.004 0.008
L
0.300 0.600 0.012 0.024
D
2.820 3.020 0.111 0.119
θ
0°
8°
0°
8°
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBNP5213N6
CYStek Product Specification